Etesian Semiconductor

 The ancient Etesian winds are considered a blessing..

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Digital and Analog

 

AAI provides a complete range of ASIC/SoC design services for digital, analog, mixed signal, Structured ASIC, and FPGA devices.  
 
AAI also conducts development of packaging solutions and test programs as well as management of turnkey manufacturing supply chain.
 
Our design platform is based on Cadence tools for RTL to GDSII flow and full custom analog design.  Our design team is well experienced with other advanced CAD tools, e.g. Synopsis and Mentor.
 
AAI partner with various IP providers to best serve our customers' needs.
 
Utilizing our in-depth industry knowledge and strong links with world-class semiconductor vendors, we grant our customers access to the most advanced design and manufacturing technologies, while providing more flexibility during the critical decision making process.
 
Services' Scope
AAI maintains a strong in-house team with a wide variety of specialized skills in ASIC/SoC, analog and FPGA design; product engineering and production handling. Our team will help you not only to design the chip, but to find the best vendors for your project and to arrange a smooth tape-out and corner lot characterization. We'll develop for you the most attractive packaging solution and most efficient test program. Our team is dedicated to providing you with timely deliveries of superior quality products.

AAI offers a full range of quality solutions for the entire product life span. Yield optimization services include yield analysis, corner lot characterization, and process re-targeting. Complete support for new products is provided, including new product qualification, failure analysis, DPPM optimization and supplier change notification programs.
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RF

With RFIC Solutions, ETesiAN Semiconductor offers all types of RFIC Design service at competitive cost with our design center in India, using variety of IC processes including GaAs, AlGaAs, Silicon CMOS, SiGe BICMOS for RFICs. We have designed MMIC and RFIC chipsets for UWB, WLAN, WiMax, PCSandcellular application.

RFIC/MMIC Design services:-
We offer RFIC/MMIC Design services with excellent performance upto customer satisfaction at very competitive price. We better understand customer need and deliver it within desired design time frame.

RF Modules/Board/System Design services:-
We provide RF Modules & boards design services to meet your requirements.We offer RF board and sub system level design layout and test. We offer complete turn key system solution with our partners

RFIC/MMIC Intellectual Property:-
We have developed 100+ RFIC building blocks covering 0 to 40 GHz


Semiconductor Foundries we are working with


Si CMOS / SiGe BiCMOS Technology

  • TSMC (180/130nm LP/RF CMOS)
  • Jazz Semiconductors (0.35/0.25/0.18/0.13um SiGe RF CMOS/BiCMOS)
  • Tower Semiconductors (0.18um RF CMOS)
  • IBM (0.18um CMOS)


GaAs pHEMT  & InGaP HBT Technology

  • Triquint Semiconductor (0.5um pHEMT/2um HBT)
  • GCS (2um InGaP HBT)
  • Win Semiconductor (0.15um Low noise pHEMT)
  • GAETEC, India (0.7um MESFET)
  • Integrate all RF Components on a Chip – Mixers, Attenuators, Switches, IF Amps, and AGC Amp etc.
  • Integrates passives on a modules (MCM).
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ESD

Beyond standard IOs - Custom built IO & ESD protection

 

Sofics has a strong expertise and IP portfolio for on-chip ESD protection. However, for some customers the requirement does not stop with ESD clamps. Together with our partners Sofics can provide vertical integrated solutions.

Sofics can custom develop solutions for low voltage, advanced CMOS as well as for high voltage CMOS, BCD technology and applications. The ESD solutions are applied for a broad set of applications like HDMI, USB 3.0, SATA, SerDes, RFID, LNA, power management, LCD/LED drivers... and enable requirements including 8kV HBM and IEC 61000-4-2.

Example

Sofics and ICsense(www.ICsense.com) have cooperated on the design of a 3.0V digital IO in TSMC 40nm for SIM and SD card interfaces for a joint customer. Sofics created customized ESD protection (power clamps and IO protection) for the 1.8V and 3.0V interface. ICsense designers created the 3.0V IO circuit based on 1.8V transistors. The result is a robust and reliable circuit where max. 1.8V is guaranteed over all transistor terminals, all process corners, over a full temperature range including at system startup

For further reading: Download Sofic's brochure (1.91 Mb)