Cutting-Edge Chip Manufacturing for Image Sensors
At Etesian Semiconductors, we specialize in design and production complex silicon wafers tailored to our customers' specific requirements, particularly in the realm of image sensors as well as other sensors. The process we’ve established for image sensor chips comprises several key stages, ensuring the delivery of high-performance, custom solutions:
1. Understanding and Selecting Production Technology
Customers engage with us after completing initial product development and feasibility studies. We work closely with them to understand their requirements, helping them choose the most suitable production technology and Flow offered by our subcontructors and partners.
Our team expertise allow us to develop special process modules and full process flows to meet the customers’ requirements.
2. Design for Manufacturability (DFM)
We collaborate closely with our customers during the chip design phase to ensure that designs are optimized for manufacturability. By considering manufacturing constraints early in the design process, we can improve yield and reduce production costs. Using cutting-edge software like Fab Design Kit, we design chip architectures that meet strict criteria such as size, speed, light sensitivity, and more.
3. Pixel Adjustment and Design
We support our customers with their pixel design and adjust dedicated pixels to meet customer specifications, divided into two phases:
Layout: Based on our deep industry knowledge and customer needs, we support the design of the pixel layout and conduct optical and electrical simulations to test its capabilities.
Process: Once the customer selects a layout, we formulate a unique production process that aligns with production machine capabilities.
To ensure the chip meets requirements, we conduct extensive optical and electrical simulations, considering the environment in which the pixel will operate.
4. Manufacturing Services
We partner with subcontractors for the manufacturing of masks and wafers, maintaining an active involvement in the production phase. Our subcontractors receive detailed instructions from us, and in many instances, our team members are physically present at the FAB, providing supervision and support throughout the production process. Additionally, we offer technical support after production to ensure the successful implementation and operation of our products.
5. Yield management
We conduct detailed yield analysis to identify patterns and trends in chip failures, this is an ongoing process at Etesian. We are committed to continuous improvement, constantly seeking new ways to enhance yield, reduce costs, and improve overall efficiency.
6. Packaging/assembly
We deliver the appropriate assembled product together with our packaging partners at the shortest time possible.
Our Commitment to Quality
We are deeply involved in the production phase, providing detailed instructions to subcontractors and often physically overseeing production. This hands-on approach ensures that the final chips meet our stringent quality standards.